What is a SOIC package?
The SOIC is a surface mount integrated circuit package. The standard form is a flat rectangular body, with leads extending from two sides. The leads are formed in a gull wing shape to allow solid footing during assembly to a PCB. The pad can be soldered to the PCB to dissipate heat.
Are SOP and SOIC the same?
SOP (JEITA/EIAJ) These are sometimes called “wide SOIC”, as opposed to the narrower JEDEC MS-012, but they in turn are narrower than the JEDEC MS-013, which may also be called “wide SOIC”.
What is Wson package?
WSON. Very-very-thin small-outline no-lead package.
What is a sop chip?
There is a new emerging concept called system-on-package (SOP). With SOP, the package, not the board, is the system. It does this by having global wiring as well as RF, digital, and optical component integration in the package, not in the chip.
What is SOT package?
Small Outline Transistor (SOT) Package. Small Outline Transistor (SOT) packages are very small, inexpensive surface-mount plastic-molded packages with leads on their two long sides. Due to their low cost and low profile, SOT’s are widely used in consumer electronics.
What is so 16 package?
Download package data for CAD tool, such as 3D model data in STEP format and reference land pattern data designed following JEITA ET-7501 Level3….SO16.
|Package Dimensions (mm) / Land pattern dimensions for reference only (mm)|
|Packing Method||Embossed Tape|
|Minimum Quantity||2000 pcs/Reel|
What is the difference between SOP and SSOP?
Specific to food manufacturing plants, the term SOP is commonly applied to production, manufacturing and support area processes, jobs or activities. For all sanitation-related processes, jobs or activities, the term SSOP (Sanitation SOP) is reserved.
How many types of chip packages are there?
45. Types of IC packages
|Terminal direction||Mounting type||Formal name|
|Contact mounting type||Dual Tape carrier Package|
|4 way direction||Surface-mounted device||Quad Flat Package|
|Thin Quad Flat Package|
|Small Thin Quad Plastic Flat Package|
What is SOP full form?
Standard operating procedure
Standard operating procedure/Full name
What is SOP and SiP?
System-in-Package (SiP) or System-on-Package (SoP) concept has been proposed for over ten years. SOP is a highly miniaturized system technology combining computing, communication, consumer, and bio-electronic functions in a single package or module.
What is the difference between SOT 23 and SOT 23 3?
Note that SOT 23 and SOT 23-3 are just names, they don’t have any definition. They have just entered the language through use and custom. JEDEC formally standardises dimensions, its TO-236AB package outline is the JEDEC title for what is known as SOT 23 and SOT 23-3. SOT23-3 is the 3 pin variant of SOT23 .
What is a DIP IC?
DIP, short for dual in-line package, is the most common through-hole IC package you’ll encounter. These little chips have two parallel rows of pins extending perpendicularly out of a rectangular, black, plastic housing. Aside from being used in breadboards, DIP ICs can also be soldered into PCBs.
How to check SO-8 vs.soic-8 packages?
Sign in to your account SO8, SO-8, SO08, SOIC-08 or similar package names may not refer to the same package. Wikipedia says there are two competing standards JEDEC and EIAJ. For each IC using such a package we should check the datasheet or even measure the device length/width itself. Probably we’ll have to introduce different packages.
What’s the difference between soic8 and sop8 pads?
If you are aiming for automated assembly, then there could be slight differences in the pads pattern on the PCB; that’s something you would discuss with whomever would be doing the assembly (prior to releasing your PCB design of course). The right pattern pretty much self-centers the pads in the solder puddle.
Which is the wide version of the SOIC package?
Next to the narrow SOIC package (commonly represented as SOx_N or SOICx_N, where x is the number of pins), there’s also the wide (or sometimes called extended) version. This package is commonly represented as SOx_W or SOICx_W . The difference is mainly related to the parameters W B and W L .
What’s the difference between JEDEC 3.9 and SOP?
However, at least TI and Fairchild consistently refer to JEDEC 3.9 and 7.5 mm width parts as “SOIC” and EIAJ Type II 5.3 mm width parts as “SOP.” The SOIC package is shorter and narrower than DIPs, the side-to-side pitch being 6 mm for an SOIC-14 (from lead tip to lead tip) and the body width being 3.9 mm.